Electronics Thermally Conductive Material Thermal Gap 1.73 g / cbm Density

Electronics Thermally Conductive Material Thermal Gap 1.73 g / cbm Density

​A-gapfill 200 is a very soft, freestanding gap filler that is more compliant than most other gap fillers. Combining good thermal conductivity of 1.1 W/mK with high conformability, this gap filler produces low thermal resistance. The alumina filler allows the product to remain a cost effective solution where moderate thermal performance is acceptable. Naturally tacky and not requiring additional adhesive coating, the
​A-gapfill 200 can inhibit thermal performance. This gap filler is both electrically insulating and stable from -40°C to 160°C and meets UL 94 VO rating.

FEATURES
• Soft and compressible for low stress applications
• Naturally tacky needing no further adhesive coating
• 1.1 W/mK thermal conductivity
• Available in thicknesses from 0.010” (0.25mm) to 0.200” (5.0mm)

APPLICATIONS
• Cooling components to the chassis or frame
• High speed mass storage drives
• RDRAM memory modules
• Heat pipe thermal solutions
• Automotive engine control units
• Wireless communication hardware

STANDARD THICKNESS
0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm) 0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm) 0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm) 0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm) 0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm) 0.190" (4.83mm) 0.200" (5.08mm) Consult the factory for alternate thicknesses

STANDARD SHEET SIZE
9" x 9" (229mm x 229mm) A-gapfill 200 may be die cut into individual shapes. Pressure sensitive adhesive is not applicable for Tflex™ products.

REINFORCEMENT
0.020" (0.51mm) and 0.030" (0.762mm) are fiberglass reinforced.

thermal conductive material

thermal interface material

Electronics Thermally Conductive Material Thermal Gap 1.73 g / cbm Density Images